- All sections
- B - Performing operations; transporting
- B23K - Soldering or unsoldering; welding; cladding or plating by soldering or welding; cutting by applying heat locally, e.g. flame cutting; working by laser beam
- B23K 3/00 - Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
Patent holdings for IPC class B23K 3/00
Total number of patents in this class: 303
10-year publication summary
|
11
|
29
|
16
|
17
|
37
|
49
|
30
|
29
|
22
|
4
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Senju Metal Industry Co., Ltd. | 654 |
15 |
| Fuji Corporation | 2924 |
10 |
| OK International Inc. | 12 |
10 |
| Hakko Corporation | 124 |
9 |
| Mitsubishi Electric Corporation | 43934 |
8 |
| Denso Corporation | 23338 |
7 |
| ERSA GmbH | 92 |
7 |
| Panasonic Intellectual Property Management Co., Ltd. | 27812 |
6 |
| Apex Brands, Inc. | 820 |
6 |
| Shinkawa Ltd. | 400 |
6 |
| Illinois Tool Works Inc. | 11152 |
5 |
| Hubbell Incorporated | 3052 |
5 |
| FANUC Corporation | 5803 |
5 |
| Kulicke and Soffa Industries, Inc. | 292 |
5 |
| International Business Machines Corporation | 60644 |
4 |
| Daikin Industries, Ltd. | 9495 |
4 |
| Showa Denko K.K. | 2539 |
4 |
| Shandong Caiju Electronic Technology Co., Ltd | 10 |
4 |
| Samsung Electronics Co., Ltd. | 131630 |
3 |
| Hitachi, Ltd. | 16452 |
3 |
| Other owners | 177 |